Abstract

This paper investigates the manufacturability-aware process of p-n junction formation for photovoltaic cells involving with Si nanoparticle layer. The furnace-based dopant diffusion process of forming a p-n junction consumes a substantial amount of energy. In addition, repetitive production steps prevent the possibility of Si ink-based cells integrating onto flexible substrates. This research examined the local heating dopant diffusion process by using a fiber laser at a wavelength of 1064 nm. The infrared beam is delivered onto the wafer stack with a nanoparticle carbon layer and n-type Si ink layer on p-type Si substrates. The nanoparticle carbon film absorbs infrared beam energy and converts photon energy as a thermal source to diffuse the n-type dopant in Si ink into the p-type Si wafer. The Si ink in this paper contains a mixture of Si nanoparticles and an n-type spin-on dopant solution. The TEM results show that Si nanoparticles are uniformly dispersed on the Si wafer surface. This research investigated sheet resistance as a function of laser parameters, including laser power, scanning speed, and pulse frequency for the samples coated with Si ink. Secondary ion mass spectroscopy measurements indicate the presence of an n-type dopant in p-type substrates, with an approximate diffusion depth of 100 nm. The results indicate that the proposed infrared laser treatment technique is promising for the formation of p-n junctions with Si ink-based photovoltaic cells.

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