Fabrication of n-Si/n-Ga2O3 heterojunctions by surface-activated bonding and their electrical properties

Abstract

We studied electrical properties of n-Si/n-Ga2O3 heterojunctions fabricated by surface-activated bonding. The energy barrier heights (qϕb) at the Si/Ga2O3 interface for different reverse voltages (Vrev) were derived from temperature-dependent current density–voltage (J–V–T) characteristics. With shifting Vrev to the negative direction, qϕb gradually decreased and reached a constant value due to negatively charged interface states. The conduction band offset at the heterointerface was estimated to be 0.18 eV from the Vrev dependence of qϕb. The qϕb calculated from a capacitance of the heterojunction at thermal equilibrium was larger than those derived from the J–V–T characteristics, attributing to spatially inhomogeneous qϕb caused by the non-uniform distribution of the charged interface states. The density of shallow interface states was also extracted from the reverse J–V–T characteristics, which was estimated to be about 6 × 1012 cm−2 eV−1.