Fabrication of multi-material electronic components applying non-contact printing technologies: A review

Abstract

Recent scientific achievements in the area of printed electronics allow the production of electronic devices with enhanced performances and versatility at a relatively low cost. The transfer from a single to multi-material applications, advances in the sequential deposition of insulators, conductors or semiconductors enable the progress from uncomplicated antennas and conductive interconnects towards fully printed complex, flexible electronic components, integrated within objects and smart devices at the same time offering greater precision and less complex manufacturing in comparison to traditional fabrication methods. In contrast to conventional fabrication techniques, additive approaches allow for avoiding expensive and tedious mask fabrication and the objects here can be quickly manufactured according to a customised design, thus making the processes feasible when rapid prototyping or fabrication of customised components are necessary. These advantages are good indicators that multi-material printed electronics will gradually replace traditional subtractive fabrication methods, thus there is keen interest to pursue research activities on this subject. Prior to continuing the research, it is of great significance to understand the recent achievements and trends in materials, processes and applications, as well as to identify potential challenges in the field of multi-material printed electronics. The purpose of this review paper is to introduce the reader to the state of art printed electronics applications, present materials, methods of fabrication as well as highlight the challenges.