Abstract

We report a fabrication method for silicon-embedded toroidal inductors with multi-layer windings, based on 3D shadow mask technology. Such multilayer devices boost inductance density within a limited footprint, which is vital for realization of integrated high-power high-frequency power converters. Fabrication of embedded toroidal inductors with double-layer windings is illustrated; characterization shows a 4x inductance increase compared to an embedded inductor with single-layer windings.

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