Abstract
In this work, a novel technology to fabricate small sized (~1cm<sup>2</sup>) c-Si photovoltaic minimodules is shown. This technology combines two main bulk micromachining techniques: fusion bonding and anisotropic etching of silicon. Due to the fact that the photovoltaic cells are fabricated in the same wafer, it is mandatory to etch the whole substrate to ensure electrical isolation. Once the individual cells are bulk-isolated they can be connected in series so as to scale up the output voltage of the miniarray. A handle wafer is required to provide mechanical stability to the device wafer. Fusion bonding is used to join the handle and the device wafer. First electrical results, under standard Air Mass 1.5 (AM 1.5) solar spectrum light (100mW/cm<sup>2</sup>), using a 9-cell serial connected minimodule, leads to a total open circuit voltage of 4.2V, a short circuit current of 2.5mA, and a maximum delivered power of 3.8mW each minimodule.
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