Abstract
Piezoelectric microdevices using lead zirconate titanate (PZT) bulk ceramics are desired for use in actuators requiring a large driving force. We have designed a fabrication process for microdevices using PZT bulk ceramics together with Si single crystals. The key techniques of the process are the bonding of PZT bulk ceramics to Si single crystals, the thinning of bulk ceramics, and the micromachining of bulk ceramics. PZT ceramics were bonded to Si using a gold thin film as an intermediate layer. The tensile strength of the PZT-Si bonded wafers depended on the PZT poling process. A dicer or a KrF excimer laser was used to cut the PZT ceramics along the designed pattern. A PZT-Si diaphragm was fabricated as an example of a basic structure that can be used in a device such as a piezoelectric micropump.
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