Abstract
In this paper, a fabrication process of ultra-high metal micro electrode array by means of UV-LIGA technology and its application in micro Electrochemical Machining (ECM) was investigated, and a new aided method, which can completely remove the ultra-thick cross-linked SU-8 resist without leaving remnants of the resist or destroying the electroplated microstructures, was advanced. During the lithography process, 1mm thick SU-8 moulds of different patterns were fabricated on the substrate. Before the electroforming process, a through-mask electrochemical micromachining (through-mask EMM) procedure was carried out to process micro roots on the substrate, the processed micro roots could improve the adhesion of micro electrode array electroformed on the substrate. After the electroforming process, cross-linked SU-8 resist was removed by the hot remover PG (MicroChem). Under the optimal experiment conditions of this fabrication process, the electrode arrays up to 800μm high of different shapes were fabricated. Finally, the fabricated electrode arrays was used as cathode to machine micro hole arrays on stainless steel by micro ECM.
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