Fabrication of hybrid self-assembled monolayer/hafnium oxide gate dielectric by radical oxidation for molybdenum disulfide field-effect transistors

Abstract

In this study, radical oxidation is applied to the fabrication of a hybrid self-assembled monolayer (SAM)/hafnium oxide (HfOx) gate dielectric in molybdenum disulfide (MoS2) field-effect transistors. The fabrication process involves radical oxidation to form HfOx at the surface of metallic HfN, SAM formation by immersion, and the deterministic transfer of MoS2 flakes. A subthreshold slope of 75 mV/dec and small hysteresis were demonstrated, indicating superior interfacial properties. Cross-sectional transmission electron microscopy revealed the uniform formation of the HfOx layer at the surface of HfN. The SAM is indispensable for the superior interfacial properties in MoS2 field-effect transistors. The radical oxidation is not restricted to the oxidation of silicon and germanium substrates and was also found to be applicable to the fabrication of a high-k gate dielectric. This study opens up interesting possibilities of radical oxidation for research on functional electronic devices.