Abstract
SU8 photoresists are used widely in the development and fabrication of the high-aspect-ratio micro-structure. However, SU8 process is difficult to repeat when the film thickness and aspect ratio are increasing. In this paper, the soft bake is investigated. The retained solvent level in SU8 film is studied by using the theory of free volume and diffusion process. The result shows that the proper and uniform solvent level in the photoresist film is crucial to achieve good SU8 microstructures in the ultra-thick film process. The microstructure with 5 μm linewidth and aspect ratios larger than 50 was obtained.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
