Abstract

Heteroepitaxial silicon films have been deposited on (1102) oriented sapphire substrates by mesoplasma chemical vapor deposition (MPCVD) at various substrate temperatures. At a temperature of 600 °C, the film was obtained at a relatively fast deposition rate of 6 nm/s, and the deposition rate further increased to 8.3 nm/s at higher temperature of 770 °C. This is an evidence of the advantage of the MPCVD for low temperature and high rate deposition compared to other heteroepitaxial processes, such as MBE and thermal CVD.

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