Abstract
Ultrafast pulsed lasers can facilitate the manufacturing of complex microstructures. However, previous laser processing applications have focused on static components. Consequently, the application of laser processing in high-performance resonant structures has received less attention. Ultrafast lasers provide a unique opportunity for realizing the structure detachment from the planar fused silica substrates. However, the processing quality has a considerable influence on resonant structures. High-quality and high-efficiency laser manufacturing methods are critical for processing resonant structures. In this study, we demonstrate a method for processing fused silica microstructures based on the femtosecond laser. We studied the influence of different laser parameters on the processing quality and determined the optimal laser parameters suitable for the microstructure. The resonant structure of the butterfly gyroscope was used to verify the manufacturing method. A steepness of 86.6° and a roughness of 653.2 nm were achieved by using the optimized laser parameters. These are expected to provide technical support for the development of high-performance fused silica dynamic devices in the future.
Highlights
In the field of micro-electro-mechanical systems (MEMS), the traditional preparation material of the resonant structure is silicon
The high thermal expansion coefficient and low quality factor of silicon result in poor temperature stability in the entire temperature range of the resonant structure and limited accuracy improvement, making it difficult to meet the requirements of high-precision applications, such as aerospace
Fused silica has good insulation, temperature stability, and high-quality factor characteristics. It is a type of structural material exhibiting significant potential for use in MEMS devices
Summary
In the field of micro-electro-mechanical systems (MEMS), the traditional preparation material of the resonant structure is silicon. The equipment for wet etching is simple, its cost is low, and its processing speed is relatively high, this process requires a specific solution ratio and precise etching time By using this method, it is difficult to process vertical side and large aspect ratio structures and to meet the complexity and diversity of processing graphics.. The extensively used laser processing methods include direct etching, laser-induced plasma etching, and laser backside wet etching.16–18 Among them, both the laser-induced plasma etching and laser backside wet etching use the laser to penetrate the fused silica to interact with the target material and generate plasma to enable the etching of the bottom surface of the fused silica. Scitation.org/journal/adv of high-performance microstructures, we propose a high-quality, high-efficiency manufacturing method
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