Abstract
The aim of this study was to propose a growth procedure for preparation of crack-free thick aluminum nitride (AlN) layers that can be easily separated from the substrate. The overall process is based on the physical vapor transport method employing a seed and a source material. In this case, the substrate is an epitaxial 4H-SiC layer and the growth of AlN is initiated at etch pits formed during the ramp up time prior to establishing growth temperature. Development of hexagonal pyramids on which arrays of microrods are formed is the core of the growth procedure. Free-standing wafers having 10 mm diameter and about 120 μm thick have been fabricated.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
