Abstract
Soft mold technique combined with a modified gelcasting process was developed to fabricate microscale piezoelectric pillar arrays. This technique involves the fabrication of high‐aspect‐ratio silicon master, generation of negative polydimethylsiloxane mold, and replica molding piezoelectric pillar array by gelcasting. A gelling system based on the polymerization of Hydantion epoxy resin and 3,3′‐Diaminodipropylamine (DPTA) was employed. Weibull analysis revealed that 20.0 wt% Hydantion epoxy resin was the optimized concentration while the highest Weibull modulus and characteristic flexural strength of 14.8 and 90.9 MPa were obtained for lead zirconate titanate sintered bodies, respectively. Excellent piezoelectric pillar arrays with lateral dimensions around 8 μm and aspect ratio higher than five were successfully fabricated.
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