Abstract

AbstractWe have investigated the device performance, such as the breakdown voltages between gate‐source contacts and drain‐source contacts, threshold voltage (Vth) and on resistance (RON), of enhancement‐mode AlxGa1–xN/GaN junction heterostructure field‐effect transistors (JHFET) with a p‐type GaN gate. Fabricating an Al0.15Ga0.85N/GaN JHFET with a gate length of 2 μm without surface passivation, we have achieved a completely enhancement‐mode JHFET with a threshold voltage of +0.55 V, and breakdown voltages between gate‐source and drain‐source were over 100 V and 250 V, respectively. RON is as low as 4.5 mΩ · cm2 at VG = 3.0 V. (© 2007 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)

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