Abstract

F 2 -laser ablation at 157 nm was used for generating sub-micron surface relief structures on fused silica to define binary diffractive phase elements (DPE). A pattern array of 128 x 128 pixels was excised using the F2 laser in combination with a high resolution processing system comprising of CaF 2 beam-homogenization optics and a high-resolution Schwarzschild reflective objective. A square projection mask provided precise excisions in less than 10 x 10 μm 2 spots, having sub-μm depths that were controlled by the laser fluence and the number of laser pulses to provide for the required phase delay between ablated and non-ablated pixels. Thus a diffractive phase element (DPE) optimized for first order in the UV spectral range was made. A four-level DPE design computed by the Iterative Fourier Transform Algorithm (IFTA) will be described for generating an arbitrary irradiation pattern without the point symmetry of a two level design.

Full Text
Published version (Free)

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call