Abstract
In this paper, we study the non-vacuum electrohydrodynamic atomization (EHDA) of solutionprocessible poly 4-vinylphenol (PVP) ink for the fabrication of dielectric thin films. In EHDA, the optimum flow rate /applied potential has been achieved by using an operating envelope. Optimized parameters have been used to generate an electrohydrodynamic jet, which subsequently is disintegrated into droplets to deposit a uniform thin film of PVP on indium-tin-oxide (ITO)-coated polyethylene terephthalate (PET) substrate with an average thickness of ∼100 nm at constant substrate speed of 0.3 mm/s. The PVP thin film has been characterized by using scanning electron microscopy (SEM), X-ray photoelectron spectroscopy (XPS) and UV-visible spectroscopy. For the current/voltage (I–V) and the capacitance/voltage (C–V) characteristics metal-insulatorsemiconductor (MIS) i.e., ITO/PVP/Poly (3, 4-ethylenedioxythiophene) poly (styrenesulfonate) (PEDOT: PSS), capacitor has been analyzed.
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