Abstract

Although ε-poly-l-lysine (ε-PL) has a good potential as a green fungicide, high concentration is usually required during its controlling of plant disease. On the other hand, same problems also appeared in the study of CuONP based nano pesticides. In this manuscript, a new composite alginate nanogel (ALGNP) that containing CuONP and ε-PL was fabricated via in situ reduction of CuONP in nanogel and ε-PL surface coating. Based on the chelation of amide bond of ε-PL and Cu2+ released by CuONP, the synergy effect between Cu2+ and ε-PL layer of the nanogel make the nanogel (CuONP@ALGNP@PL) performed high anti-fungal activity under low Cu2+ and ε-PL concentration (Cu concentration was 40.09 μg/mL, ε-PL concentration was 11.90 μg/mL). Study showed that the nanogel could more significantly destroy the fungal cell membrane than CuONP@ALGNP and ALGNP@PL, also better than commercial fungicide CuCaSO4 (Cu concentration was 120 μg/mL). Furthermore, CuONP@ALGNP@PL could seriously affect the spore production, spore germination rate and bud tube elongation length of Alternaria alternate. Moreover, CuONP@ALGNP@PL also inhibit Botrytis cinerea, Phytophthora, Thanatephorus cucumeris and Fusarium graminearum. These results showed that composite of CuONP and ε-PL based on nanogel can decrease the raw materials application amount, and achieve a high disease controlling ability, which provides a new perspective for preventing fungal diseases.

Full Text
Paper version not known

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.