Fabrication of an infrared emitter using a generic integration platform based on wire bonding

Abstract

This paper reports a novel approach for the fabrication of infrared (IR) emitters for non-dispersive IR gas sensing. The proposed concept enables the integration of superior resistive heater materials with microelectromechanical system structures. In this study, non-bondable filaments made of nickel chromium are attached to mechanical attachment structures using a fully automated state-of-the-art wire bonder. Formation of electrical contact between the integrated filaments and the electrical contact pattern on the substrate is performed using conventional gold stud bumping technology. The placement accuracy of the integrated filaments is evaluated using white-light interferometry, while the contact formation using stud bumping to embed the filaments is investigated using focused ion beam milled cross-sections. A proof-of-concept IR emitter has been successfully operated and heated up to in continuous mode for 3 h.