Fabrication of an advanced epoxy based molding compound with high thermal conductivity and outstanding mechanical properties

Abstract

Abstract A novel molding compound was fabricated through surface modification of aluminum particles followed by chemical grafting to an epoxy based resin. The fabricated material demonstrated high thermal conductivity and outstanding mechanical properties. A thin layer of alumina was formed on the surface of aluminum particles (spherical with average 30 μm in diameter) by ultrasonic treatment with hydrogen peroxide followed by functionalization with a hydroxylated long-chain organic acid. The fabricated composite was chemically bonded to epoxy skeleton. The chemical bond formation between the filler and organic matrix was responsible for high thermal conductivity as well as outstanding mechanical properties. As well, the loading capacity of epoxy matrix to surface modified fillers was remarkably higher than non-modified fillers.