Abstract
We fabricate high-quality Al/AlOx/Al junctions using improved bridge and bridge-free techniques at 30-keV e-beam voltage, in which the length of undercut and the size of junction can be well controlled by the pre-exposure technique. The dose window is 5 times as large as that used in the usual Dolan bridge technique, making this technique much more robust. Similar results, comparable with those achieved using a 100-keV e-beam writer, are obtained, which indicate that the 30-keV e-beam writer could be an economic choice for the superconducting qubit fabrication.
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