Fabrication of a two-dimensional piezoelectric micromachined ultrasonic transducer array using a top-crossover-to-bottom structure and metal bridge connections

Abstract

A new design methodology and fabrication process for two-dimensional (2D) piezoelectric micromachined ultrasonic transducer (pMUT) arrays using a top-crossover-to-bottom (TCTB) structure was developed. Individual sensing and actuation of pMUT elements from a small number of connection lines was enabled by the TCTB structure, and the parasitic coupling capacitance of the array was significantly reduced as a result. A 32 × 32 pMUT array with a TCTB structure was fabricated, resulting in 64 connection lines over an area of 4.8 × 4.8 mm2. The top electrodes for each pMUT element were re-connected by metal bridging after bottom-electrode etching caused them to become disconnected. A deep reactive ion etching process was used to compactify the array. Each pMUT element was a circular-shaped K31-type ultrasonic transducer using a 1 µm thick sol–gel lead zirconate titanate (PZT: Pb1.10 Zr0.52 Ti0.48) thin film. To characterize a single element in the 2D pMUT array, the resonant frequency and coupling coefficient of 20 pMUT elements were averaged to 3.85 MHz and 0.0112, respectively. The maximum measured ultrasound intensity in water, measured at a distance of 4 mm, was 4.6 µW cm−2 from a single pMUT element driven by a 5 Vpp sine wave at 2.22 MHz. Potential applications for development of a TCTB-arranged 2D pMUT array include ultrasonic medical imaging, ultrasonic communication, ultrasonic range-finding and handwriting input systems.