Abstract
One of the main issues with micron-sized intracortical neural interfaces (INIs) is their long-term reliability, with one major factor stemming from the material failure caused by the heterogeneous integration of multiple materials used to realize the implant. Single crystalline cubic silicon carbide (3C-SiC) is a semiconductor material that has been long recognized for its mechanical robustness and chemical inertness. It has the benefit of demonstrated biocompatibility, which makes it a promising candidate for chronically-stable, implantable INIs. Here, we report on the fabrication and initial electrochemical characterization of a nearly monolithic, Michigan-style 3C-SiC microelectrode array (MEA) probe. The probe consists of a single 5 mm-long shank with 16 electrode sites. An ~8 µm-thick p-type 3C-SiC epilayer was grown on a silicon-on-insulator (SOI) wafer, which was followed by a ~2 µm-thick epilayer of heavily n-type (n+) 3C-SiC in order to form conductive traces and the electrode sites. Diodes formed between the p and n+ layers provided substrate isolation between the channels. A thin layer of amorphous silicon carbide (a-SiC) was deposited via plasma-enhanced chemical vapor deposition (PECVD) to insulate the surface of the probe from the external environment. Forming the probes on a SOI wafer supported the ease of probe removal from the handle wafer by simple immersion in HF, thus aiding in the manufacturability of the probes. Free-standing probes and planar single-ended test microelectrodes were fabricated from the same 3C-SiC epiwafers. Cyclic voltammetry (CV) and electrochemical impedance spectroscopy (EIS) were performed on test microelectrodes with an area of 491 µm2 in phosphate buffered saline (PBS) solution. The measurements showed an impedance magnitude of 165 kΩ ± 14.7 kΩ (mean ± standard deviation) at 1 kHz, anodic charge storage capacity (CSC) of 15.4 ± 1.46 mC/cm2, and a cathodic CSC of 15.2 ± 1.03 mC/cm2. Current-voltage tests were conducted to characterize the p-n diode, n-p-n junction isolation, and leakage currents. The turn-on voltage was determined to be on the order of ~1.4 V and the leakage current was less than 8 μArms. This all-SiC neural probe realizes nearly monolithic integration of device components to provide a likely neurocompatible INI that should mitigate long-term reliability issues associated with chronic implantation.
Highlights
Implantable neural interfaces offer a method for external electronic devices to be connected to the central nervous system (CNS) in order to stimulate or record neurological signals, such as action potentials or multi-unit extracellular potentials, with the additional benefit of high spatial and temporal resolution
Epitaxial 3C-silicon carbide (SiC) Films A cross-sectional scanning electron microscopy (SEM) view of the wafer, which allows for accurate estimation of film thickness (n+, p-ASicCr,osSsi-dseecvtiiocneafil lSmE,Manvdiewbuorfiethdeowxiadfeer), wishsihchowalnlowinsFfiogruarcecu2raa.teTehsitsimfigatuioren hoifgfhilmligthhtisckvnaersios us lay(ner+-s, apn-SdiCth, eSiadpepvriocexifmilmat,eatnhdicbkunreiessd oofxeidaec)h, ilsaysheorwonn tinheFiwguafreer2ua.seTdhifsofrigthuerefahbigrhiclaigthiotsn.vaTrhioeutswo epliatayxeirasl a3nCd-StihCefialpmpsrowxeimreamteetahsiucrkende,sasnodf tehaecihr claoymerbionnedthtehiwckanfeerssudseedtefromritnheedftaobbrieca~t1io0nμ. mTh. eThtwe oSOI Si edpeivtaicxeialla3yCe-rS(i~C2f6ilμmms )w, aersewmeellaasusrtehde, tahnidn t(h~e2irμcmom) bbuinreieddthoixcikdneeslasydeertearrme ianlseod vtoisbibele~1i0n μthmis
Neural probes with sixteen traces, electrode sites, and other test structures were patterned on the 3C-SiC epilayers via MEMS microfabrication processes
Summary
Implantable neural interfaces offer a method for external electronic devices to be connected to the central nervous system (CNS) in order to stimulate or record neurological signals, such as action potentials or multi-unit extracellular potentials, with the additional benefit of high spatial and temporal resolution. Study of the visual cortex, which requires a denser array of electrodes, drove a transition from metal wire electrode arrays to silicon-based three-dimensional microelectrode arrays (MEAs), such as the Utah array, which was introduced in the late 1980s [5,6] This design minimized the electrode area and, as a result, allowed for higher spatial resolution during recording and stimulation of small populations of neurons, as well as utilized a reliable and repeatable manufacturing process.
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