Abstract
We propose a hermetic sealing of a glass-to-glass structure which has an I-structure through-glass interconnect via (TGV) filled with submicron Au particles. A TGV sandwiched between two Au bumps is defined as I-structure TGV. The I-structure TGV was formed by the use of simple filling process with a resist hole and a vacuum condition. The samples were bonded at 200 °C under the vacuum of 0.50 Pa by using a low temperature Au/Au bonding pretreated with vacuum ultraviolet irradiation in the presence of oxygen gas (VUV/O3). The bonded samples showed He leakage rates of less than 5.0 × 10−9 Pa·m3 s−x1, which is the rejection limit defined by the MIL-STD-883G specification. This result indicates that proposed I-structure TGV is useful for a hermetic sealing device.
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