Abstract
Inkjet based 3D printing technology discharges fine ink droplets from multiple printer heads to perform patterning and depositing in the target locations. The inkjet 3D printing can be differentiated from other 3D printing processes. It can print multiple materials simultaneously by using multiple printer heads, thus it is appropriate to create heterogeneous complex structure such as electronic devices. This study demonstrated the inkjet 3D printing to manufacture multi-layer composite structures using photocurable SiO2 ink and intense pulsed light (IPL) sinterable conductive Cu ink. The rheology and deposition behavior of each ink were investigated so that it could be applied for inkjet 3D printing. The various shape of 3D structures which are consist of insulative and conductive layers were fabricated to study the applicability of inkjet 3D printing in the electronics.
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