Abstract
In micro-EDM, it is difficult to prepare the 3D microelectrodes through traditional methods. Therefore, micro-EDM usually adopts the method of layer by layer scanning discharge machining to prepare 3D microstructure by using microelectrode with a simple cross section shape, which has the disadvantages of complicated process and low processing efficiency. Focus on the above problems, this paper used laminated object manufacturing (LOM) to superimpose multi-layer thin microstructures to fabricate 3D microelectrodes. Then, micro-EDM adopted the 3D microelectrode to machine 3D microstructure. The thin microstructures were fabricated through wire-EDM of copper foil and these copper foil 2D microstructures were welded together by using diffusion welding. Through the above process, the 3D microelectrode can be obtained. To improve the machining accuracy of 3D microstructure, 3D microelectrode array was fabricated and used to process the same 3D microstructure, which the rough machining and finish machining were carried out in sequence. Compared with the layer by layer scanning discharge machining, the 3D microstructure can be obtained by the up and down reciprocating method of the 3D microelectrode array, which is simple and efficient.
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