Abstract
A novel fabrication process is presented that uses liquid crystal polymer (LCP) film with copper filled thermal vias to construct a flat micro heat pipe (MHP) suitable for thermal management of semiconductor devices. LCP is chosen for its high chemical resistance, reliability, flexibility, and its ability to be readily incorporated into current mass production technologies. Copper filled thermal vias are formed in the evaporator and condenser regions of the MHP to decrease the thermal resistance of the LCP casing. In addition, a novel method for bonding woven mesh to liquid flow channels has been developed. The polymer MHP has been tested and the results show an average steady state effective thermal conductivity of 851 W/mmiddotK with an input heat flux of 3.0 W/cm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> .
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