Abstract
We introduce a method based on directed molecular self-assembly to manufacture and electrically characterise C-shape gold nanowires which clearly deviate from typical linear shape due to the design of the template guiding the assembly. To this end, gold nanoparticles are arranged in the desired shape on a DNA-origami template and enhanced to form a continuous wire through electroless deposition. C-shape nanowires with a size below 150nm on a {hbox {SiO}_2}/hbox {Si} substrate are contacted with gold electrodes by means of electron beam lithography. Charge transport measurements of the nanowires show hopping, thermionic and tunneling transports at different temperatures in the 4.2K to 293K range. The different transport mechanisms indicate that the C-shape nanowires consist of metallic segments which are weakly coupled along the wires.
Highlights
We introduce a method based on directed molecular self-assembly to manufacture and electrically characterise C-shape gold nanowires which clearly deviate from typical linear shape due to the design of the template guiding the assembly
The electrical properties of these nanowires were tested at temperatures ranging from 4.2 K to room temperature (RT) (293 K)
The particular shape of the nanowires was obtained by the binding of 8 functionalized AuNPs at specific capture sites for each and strategically separated by 16 nm on the DNA origami surface
Summary
We introduce a method based on directed molecular self-assembly to manufacture and electrically characterise C-shape gold nanowires which clearly deviate from typical linear shape due to the design of the template guiding the assembly To this end, gold nanoparticles are arranged in the desired shape on a DNA-origami template and enhanced to form a continuous wire through electroless deposition. Electric charge transport of such wires shows a widespread range in resistances from a few tens of ohms up to several gigaohms These results suggest that the fashioning of metal NPs on the origami nanostructure and their coalescence during metallization control the resistance, whereas the length and width of the final structure hardly influence the electrical p roperties[19,27,28,33]. They often contain gaps between the metal nanoparticles which appear during growing and merging the AuNPs on the surface of the DNA o rigami[34]
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