Abstract
Novel flexible polymer blend films from polycondensed Fused Polynuclear Aromatic (COPNA) resin/nylon 6 have been reported.1 To fabricate polymer blend films using the COPNA resin industrially by solution casting, a solvent soluble nylon was more suitable than nylon 6 for the blend polymer, because the former nylon was soluble in a common solvent. Fabrication and the properties of the new blend films were studied here. The morphology and properties of both B-staged and fully-cured films were compared with those of nylon 6 systems previously reported. 30/70 and 50/50 (COPNA/solvent soluble nylon) systems were found to exhibit sufficient flexibility and heat resistant property suitable for base materials of flexible printed wiring boards.
Sign-in/Register to access full text options 
Free) 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
