Abstract
Al/Ti multilayer films with bilayer thicknesses of 50nm, 100nm and 200nm were prepared by RF magnetron sputtering alternate Al and Ti layers. The relative thickness of Al and Ti layers was maintained at a 1:1 ratio in order to obtain a 1:1 atomic ratio. XRD measurements show that the compound of AlTi is the final product of the exothermic reactions. DSC curves show that the values of heat release in Al/Ti multilayer films with bilayer thicknesses of 50nm, 100nm and 200nm are 457.99 J∙g-1, 493.42 J∙g-1 and 696.81 J∙g-1, respectively. The exothermic reaction in Al/Ti multilayer films lead to more intense electric explosion. Al/Ti multilayer bridge films with modulation period of 50nm explode more rapidly and intensely than other bridge films because decreasing the bilayer thickness results in an increased reaction velocity.
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