Fabrication and measurement of BPF using IPD technology

Abstract

Band-pass-filters (BPF) are critical components in the RF modules. Conventional discrete component solutions, like those from discrete SMDs or LTCC (Low temperature co-fired ceramic) technology. Typically, these passive components consume 60%-70% of the footprint area. As miniaturization is becoming a trend for cost-reduction of wireless products, there is a need to make these devices in smaller form-factors. Integrated passive devices (IPDs) have attracted much attention in recent years, primarily due to the need of handheld and wireless devices to further decrease in cost and size and increase in functionality.