Fabrication and investigation of in-plane compliant SU8 structures for MEMS and their application to micro valves and micro grippers

Abstract

Abstract This paper demonstrates the versatile application potential of SU8 photoepoxy for micromechanical components. Its outstanding aspect ratio and attainable film thicknesses enable the design of structures such as beams and hinges that are compliant in the wafer plane. The applicability of this technology is demonstrated on shape memory alloy and pneumatically actuated micro grippers [1] , [2] as well as a micro fluidic channel with integrated check valve. Besides reporting on the improved technology for 300–400 μm SU8 structures, we will present elastic material properties measured on micro compliant beams and flexural hinges employing a tactile force sensor [3] . The material properties measured on micro specimen are compared to large scale standard tensile test results.