Fabrication and Integration of DOEs into High Density Vertical Interconnects

Abstract

Diffractive optical element (DOE) designs and fabrication techniques were investigated for a vertical optical interconnect architecture illustrated in Fig 1. This design provides high interconnect densities for stacked Multi Chip Module (MCM) computer architectures required in future high speed, low power, and small size computer systems. A 16 channel interconnect was demonstrated and an evaluation of greater interconnect densities is presented. Key design parameters for this effort were: ease of fabrication, compatibility of fabrication techniques with industry standards, density of interconnects, misalignment tolerance, data rates, and power consumption.