Fabrication and heat dissipation performance of diamond/Cu composite with diamond bars inserted in the normal direction

Abstract

In this paper, a new type of diamond/Cu composite with diamond bars inserted in the normal direction is designed and prepared by vacuum brazing. In order to reduce the negative effect of the low thermal conductivity of Cu-Sn-Ti solder, diamond particles were added into the solder area. The microstructure, thermal conductivity, and heat dissipation performance of the diamond/Cu composite under water-free and water-cooling conditions were studied and compared. Besides, the heat dissipation mechanism of the composite was explored through finite element analysis. The results show that the diamond bars and diamond particles can be connected well by the CuSnTi solder, and the diamond particles scatter in the solder area. The TC tests show that the sample with 2000 mesh diamond particles has the highest TC (515.25 W/(m·K)). Besides, both the heating experiments on the electronic heating platform and the actual heat dissipation performance under water-cooling conditions affirm the excellent heat dissipation effect of the composite with 2000 mesh diamond particles. In conclusion, the diamond/Cu composite with diamond bars inserted vertically possess an excellent structural design, which is promising in heat dissipation material for electronic devices.