Abstract
Excellent thermal resistance and thermal conductivity are preconditions of materials to be used at elevated temperatures. Herein, boron nitride and polyarylene ether nitrile hybrids (PEN-g-BN) with excellent thermal resistance and thermal conductivity are fabricated. Phthalonitrile-modified BN (BN-CN) is prepared by reacting hydroxylated BN with isophorone diisocyanate (IPDI) and 3-aminophxylphthalonitrile (3-APN), and then characterized by FT-IR, UV-Vis, and X-ray photoelectron spectroscopy (XPS). The obtained BN-CN is introduced to a phthalonitrile end-capped PEN (PEN-Ph) matrix to prepare BN-CN/PEN composites. After curing at 340 °C for 4 h, PEN-g-BN hybrids are fabricated by a self-crosslinking reaction of cyano groups (-CN) from BN-CN and PEN-Ph. The fabricated PEN-g-BN hybrids are confirmed through FT-IR, UV-Vis, SEM and gel content measurements. The PEN-g-BN hybrids demonstrate excellent thermal resistance with their glass transition temperature (Tg) and decomposition temperatures (Td) being higher than 235 °C and 530 °C, respectively. Additionally, the thermal conductivity of the prepared PEN-g-BN hybrids is up to 0.74 W/(m·k), intensifying competitiveness of PEN-g-BN hybrids for applications at elevated temperatures.
Highlights
Thermal conductive materials, which are indispensable functional materials in modern industry and life, are widely used in aerospace, electromagnetic shielding, microelectronic packaging, and other fields [1,2,3,4]
Since the Polyarylene ether nitrile (PEN) backbone contains a large number of cyano groups (-CN), it shows the following advantages: (1) the -CN exhibits a strong polarity which can promote the adsorption of the polymer on various placodes and enhance the dielectric constant of PEN; (2) the -CN at the molecular chain of PEN self-crosslinks at elevated temperature, thereby increasing the application temperature of PEN; (3) the -CN of PEN can react with other functional fillers, improving the interfacial compatibility between the matrix and the incorporated fillers [10,11,12,13]
BN and PEN hybrids connected by a covalent bond were prepared to improve the thermal conductivity of PEN
Summary
Thermal conductive materials, which are indispensable functional materials in modern industry and life, are widely used in aerospace, electromagnetic shielding, microelectronic packaging, and other fields [1,2,3,4]. For the sake of enhancing its thermal conductivity, an effective way is to introduce fillers with free electrons or a regular lattice forming a thermal conductive channel in the PEN matrix. In order to improve the preparation efficiency, Xiao et al [32] have proposed preparing BN@(sulfonated PEN (SPEN)) by coating h-BN with SPEN and adding BN@SPEN to PEN, obtaining a composite with thermal conductivity of up to 0.7 W/(m·k). This method is used to obtain a core-shell structure of fillers by reacting carboxyl groups from SPEN with hydroxyl groups from BN. Due to the formation of the hybrids, BN demonstrates excellent compatibility with the PEN matrix and improved thermal conductivity of the hybrids is obtained
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