Fabrication and cutting performance of a new type of abrasives-helix-distribution saw wire for slicing KDP crystal

Abstract

In the slicing process of KDP crystal, due to the characteristics of long sawing kerf length, low hardness, and easy cracking, etc., there is a high requirement for the lubrication and chip discharge performance of the sawing area during slicing. So there are higher requirements on the structure and cutting performance of the saw wire to improve the sawn surface accuracy and the stress distribution in the processing area to avoid crystal cracking. In this paper, based on the technical idea of orderly arrangement of abrasives on the surface of superhard abrasive tool, the fabrication process, surface structure parameters, and sawing performance of a new type of abrasives-helix-distribution electroplated saw wire for slicing KDP crystal are carried out. The manufacturing process of the abrasives-helix-distribution saw wire was established, and the electroplating process parameters were determined. The relationship between the surface structure parameters of the new type wire was analyzed, and the influences of different structural parameters on the cutting performance of the new type wire were studied; then, the reasonable combination of the surface structure parameters of the new type wire was determined. The results are helpful to further understand the influences of surface structure parameters on the sawing performance of the new type wire, and provide experimental basis and reference for the development of the abrasives-helix-distribution saw wire for slicing KDP crystal.