Abstract
Ni-decorated h-BN powders are fabricated with ChCl-EG as additive via electroless plating in the paper. As comparison, the different additive concentration of choline chloride-ethylene glycol (ChCl-EG) ionic liquid (0 g l−1, 30 g l−1, 60 g l−1, 90 g l−1) is presented. The effects of ChCl-EG concentration are studied, including the surface morphologies, phase analysis of Ni-decorated h-BN powders and the residual Ni2+ concentration is measured in electroless plating bath. It is demonstrated that the deposition phenomena of nickel particles on h-BN surface is changed with the addition of ChCl-EG. When the concentration of ChCl-EG is 30 g l−1, the Ni particles on h-BN surface are in dispersed and spheroid state with the average size of 10–1000 nm. It can be found that 30 g l−1 ChCl-EG is conducive to the arise of deposition phenomena, which is the formation of the single nickel particle on h-BN surface. Besides, more Ni particles are deposited on h-BN surface with the increase of nickel plating times, which is characterized with scanning electron microscope and transmission electron microscope. Furthermore, the deposition phenomenon and growth mechanism are proposed without and with ChCl-EG as additive to further elaborate the formation of Ni particles on h-BN surface.
Highlights
Electroless deposition process is an autocatalytic chemical reaction in aqueous solution which is used in surface metallization of conductive or non-conductive substrates, the extensive and potential surface engineering has been much faster developed [1,2,3,4]
In order to analyse the effect of choline chloride (ChCl)-ethylene glycol (EG) ionic liquid on the electroless deposition technique, the deposition experiments with different concentration of ChCl-EG are performed
It shows that the Ni2+ concentration in electroless plating bath is minimum with 30 g l−1 ChCl-EG as additive at any reaction time, this indicates that 30 g l−1 ChCl-EG ionic liquid is beneficial to deposit Ni particles from the solution
Summary
Electroless deposition process is an autocatalytic chemical reaction in aqueous solution which is used in surface metallization of conductive or non-conductive substrates, the extensive and potential surface engineering has been much faster developed [1,2,3,4]. Comparing with the conventional electroplating process, the electroless deposition technique offers impressive advantages in terms of lower processing cost because the electricity is not involved It is possible for getting deposition on materials with the excellent properties by adjusting of the composition, the pH and the temperature of an electroless bath [8,9,10]. Ru et al fabricated Ni-decorated Al2O3 powders with [bmim] ionic liquid as additive, decreasing Ni clusters on the surface of Al2O3 powders and electroless plating bath. Ni-decorated h-BN powders are fabricated by electroless deposition from sulfate solution with ChCl-EG ionic liquid as additive. The effects of ChCl-EG concentration are studied, including the surface morphologies, the residual Ni2+ concentration is measured in electroless plating bath and the element distribution of Ni-decorated h-BN powders. Based on the experimental results, an empirical model of deposition phenomenon without and with ChCl-EG as additive is proposed to further elaborate the formation mechanism of Ni-decorated h-BN powders
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