Abstract
Interposer to interconnect between the electronic components has been developed for the last few decades because it can improve the system performance effectively, compared to the system with intra-chip wiring. In this paper, the integrated stack capacitor (ISC) embedded interposer system was demonstrated with the approximately 8 times higher capacitance (C <inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">i</inf> ) than interposer with MIM (Metal / Insulator / Metal capacitor). The resistance and leakage current were measured and the results indicate that there were no the open fail inside the system. In addition, WLR (Wafer Level Reliability) was proved using TDDB (Time Dependent Dielectric Breakdown), Vramp, HTS (High Temperature Storage), TC (Thermal Cycle) and Pre-con tests and finally, all requirements of WLR are satisfied.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
