Fabrication and characterization of InN-based metal-semiconductor-metal infrared photodetectors prepared using sol–gel spin coated technique

Abstract

We report on the growth and characterization of undoped indium nitride (InN) thin films grown on a silicon substrate. The InN thin films were grown on aluminium nitride (AlN) template with gallium nitride (GaN) nucleation layer using a relatively simple and low-cost sol–gel spin coating method. The crystalline structure and optical properties of the deposited films were investigated. X-ray diffraction and Raman results revealed that InN thin films with wurtzite structure were successfully grown. For InN thin film grown on a substrate with the GaN nucleation layer, its strain and dislocation density are lower than that of the substrate with the AlN nucleation layer. From the ultra-violet-visible diffuse reflectance spectrum analysis, the energy bandgap of the InN thin films with the GaN layer was 1.70 eV. The potential application of the sol–gel spin-coated InN thin films was also explored. Metal–semiconductor–metal (MSM) infrared (IR) photodetectors were fabricated by depositing the platinum contacts using two interdigitated electrodes metal mask on the samples. The finding shows that the device demonstrates good sensitivity and repeatability towards IR excitation at a wavelength of 808 nm. The photodetector characteristics at dark and photocurrent conditions such as Schottky barrier height (SBH) and ideality factor are determined. Upon exposure to the IR source at 3V applied bias, InN/AlN/Si device configuration displays rapid rise time of 0.85 s and decay time of 0.78 s, while InN/GaN/AlNSi demonstrates slow rise time of 7.45 s and decay time of 13.75 s.