Abstract
Nanotwinned copper (nt-Cu) is drawing wide attention for it simultaneously demonstrates high strength and high ductility, which are thought to be mutually exclusive. According to previous studies, nanotwinned Cu may be the best structure for resisting electromigration damage. In this study, we deposit (111)-oriented nt-Cu using direct current with suitable additives on PCB substrates. Current density and the plating bath are variables. After copper electroplating, XRD, FIB, EBSD were used to observe the microstructure of the films. We found that the as-deposited Cu has >30% (111)-oriented nt-Cu on the polymer substrate. The microstructures of the highly (111)-oriented nt-Cu will be presented.
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