Abstract
This study focuses on the development of novel bio-composites via the pretreatment of corn straw particles (PCSP) and modified ammonium lignosulfonate (MAL) as a binder. The corn stalk particles (CSP) were pretreated with polyethylenimine (PEI) to enhance compatibility. The effects of PEI dosage on the mechanical properties and dimensional stability were examined, where PEI pretreatment improved the interfacial properties of MAL and CSP considerably. The optimum values of the PCSP/MAL composites complied with the Chinese national standard for load-bearing particleboard. Furthermore, the results confirmed that PEI pretreatment resulted in good surface activity and exhibited a favorable effect on the crystallinity of the PCSP/MAL composites. The storage moduli E′ and tan δ peak of the PCSP/MAL composites were considerably greater than those of the CSP/MAL composites. The fractured morphology of the composites clearly showed that PEI pretreatment improves the interfacial adhesion of MAL and CSP.
Highlights
The overwhelming depletion of our natural forests has spurred governments into proclaiming limits on the exploitation of wood sources
This paper investigates the feasibility of novel biocomposites via pretreatment of corn straw particles (PCSP) with a modi ed ammonium lignosulfonate (MAL) binder
In order to improve the interfacial adhesion between MAL and corn stalk particles (CSP), novel PEI treatment of CPS was adopted
Summary
The overwhelming depletion of our natural forests has spurred governments into proclaiming limits on the exploitation of wood sources. It has become increasingly important to manufacture board from non-wood sources. Different types of bindless boards from non-wood plant ber sources have been developed, which include wheat straw,[1] corn stalk,[2,3] kenaf straw[4,5,6] and rice straw.[7] Zhou et al.[8] developed an environmentally friendly thermal insulation material from cotton stalk bers eliminating the need for resins and chemical additives. These de ciencies limit their industrial applications,[10] various types of adhesives are employed in non-wood plant boards, such as UF resin,[11,12] PF resin,[13] MUF thermoset resin,[14] and polymeric diphenylmethane diisocyanate (pMDI) resin.[9]
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