Fabricated multilayer SIW system using PCB manufacturing process

Abstract

The challenge to acquire new and realistic means to practically demonstrate innovative technical-based RF solution has led designers to pursue and optimize available fabrication techniques. In this paper, design properties and versatility exhibited in SIW design have been explored, realized, and characterized in a proposed multilayer SIW prototype solution for 10.0 GHz. The assembled system consists of SMA-microstrip input interface with the low-loss microstrip-taper via transition, two manually stacked SIW structures electrically connected via small rectangular slot opening, and finally radiated by a SIW slot array antenna. The proposed system is designed using CST software and fabricated using conventional Printed Circuit Board (PCB) manufacturing process on Rogers 4003 C with e r = 3.38 and thickness of 0.813 mm. The close agreement between simulated and measured result indicating resonance occurring at 10.0 GHz. The prototype has measured return loss of −21.5 dB, bandwidth of 300 MHz, and gain of 6.1 dBi. Meanwhile, the beamwidth in E-plane and H-plane are 62.0 degrees and 94.0 degrees, respectively. The assembled multilayer SIW system, although fabricated using conventional PCB manufacturing process, shows potential in several RF applications such as satellite and radar application.