Abstract
The effect of equal channel angular pressing (ECAP) through the route Bc and aging treatment on the grain structure and properties of the Cu–1Cr–0.2Si alloy was investigated. Microstructure was detected by scanning electron microscopy (SEM), x-ray diffraction (XRD), and electron backscatter diffraction (EBSD) and the mechanical properties and electrical conductivity were tested. Results shown that after ECAP, accompanying the grains refined to nano-and submicron-structure, the Cr particles were gradually spread along the grain boundaries (GBs), aging treatment promoted Cr particles dispersed in the matrix. ECAP greatly increased the ultimate tensile strength (UTS) while having a small effect on the conductivity, and aging treatment increased electrical conductivity. The stable {111}<110> texture after ECAP and the lower dislocation density after aging treatment maybe the main reasons for the high conductivity of the material.
Highlights
Cu–Cr alloys are widely used in integrated circuit lead frames, electric locomotive contact lines, and other fields due to its excellent electrical, thermal conductivity, and high strength [1,2,3].The mechanical properties of the alloy can be improved by precipitation strengthening, theCr element has a low solid solubility in Cu, especially at room temperature or lower Cr alloys [4], which makes it difficult to increase the strength of the as-cast Cu–Cr alloys
Tian et al [5] found that the Zr element can inhibited the formation of the eutectic Cr phase, which refines the dendritic Cr phase and generates flaky Cu–Zr intermetallic compounds that significantly improve the thermal stability of the material
During equal channel angular pressing (ECAP) deformation through the route Bc, the microstructure of the Cu–1Cr–0.2Si alloy was gradually refined into a fibrous structure, and distributed along the extrusion direction
Summary
Cu–Cr alloys are widely used in integrated circuit lead frames, electric locomotive contact lines, and other fields due to its excellent electrical, thermal conductivity, and high strength [1,2,3].The mechanical properties of the alloy can be improved by precipitation strengthening, theCr element has a low solid solubility in Cu, especially at room temperature or lower Cr alloys [4], which makes it difficult to increase the strength of the as-cast Cu–Cr alloys. The mechanical properties of the alloy can be improved by precipitation strengthening, the. Tian et al [5] found that the Zr element can inhibited the formation of the eutectic Cr phase, which refines the dendritic Cr phase and generates flaky Cu–Zr intermetallic compounds that significantly improve the thermal stability of the material. Batawi et al [6] found that the addition of Mg and Zr can change the order of precipitation phase in Cu–Cr alloys and increase the materials’ peak strength. Si has an effect on the deoxidation purification and solid solution strengthening of Cu–Cr alloys. The Ni2 Si phase, which forms after the addition of Si and Ni elements, can further refine the precipitated phase particles and effectively increase the tensile strength and softening resistance of the alloy, but has little effect on the electrical conductivity [7,8]
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