Abstract
A wiring substrate in electronic equipments is a composite board, which consists of several elements having different thermal conductivities, such as wires, vias and matrixes. This paper describes the theoretical investigation on the simple equations to estimate the effective thermal conductivity of such a composite system. Two types of simple estimation equations are derived based on thermal resistance network models. Three-dimensional simulation is also performed to obtain the effective thermal conductivity of the composite system. By changing the geometrical layout and the ratio of thermal conductivities of the composite system, the estimated values by simple equations are compared with the calculated ones by simulation, and the discussion is made on the validity of simple equations.
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