Abstract
We report on digital etching of silica colloidal photonic crystals by employing a pulsed deep-ultraviolet F2 laser at 157nm wavelength. When the laser fluence is above a microsphere-size-dependent threshold and within an appropriate fluence window, colloidal crystals can be etched in a digitized fashion, whereby a single microsphere layer can be removed upon exposure to a single laser pulse. Alternatively, single spheres or lines of spheres can be selectively ejected by patterning the laser beam. The results demonstrate a fast, noncontact, straightforward, and cost-effective approach for engineering extrinsic defects into colloidal photonic crystals.
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