Abstract
This paper presents the combination of an innovative assembly and packaging process utilising solid liquid inter diffusion (SLID) Cu-Sn interconnects within bespoke ceramic substrates that have been produced using additive manufacturing (AM). The resultant process chain supports the integration and packaging of power electronics for harsh environment applications. Here, the authors explore how the bond strength and composition of Cu-Sn SLID interconnects vary during exposure to thermal-mechanical load profiles. Samples of Cu-Sn are exposed to thermal loading up to 300°C and integrated mechanical loading via high random frequency vibrations (1 and 2000 Hz). In parallel, micro-extrusion printing methods in which high-viscosity ceramic pastes are dispensed through cylindrical fine nozzles (2–250 µm) using CNC-controlled motion has enabled complex 3D geometries to be fabricated. Additional secondary conductor deposition after firing the ceramic substrate enables the electronic circuitry to be generated without dedicated tooling, masks, or templates. This work presents the first fully 3D-printed ceramic-based electronic substrates. To demonstrate the applications of this printing method, a 555 timer circuit with flashing LED has been printed and the components surface mount assembled. The resultant ceramic substrates are dense, mechanically robust, and the reflowed circuit functions exactly as intended.
Highlights
Across a myriad of industrial sectors, ranging from aviation, space, subsea, and energy, high value assets are deployed in harsh environments
We report how micro-extrusion printing methods in which high-viscosity ceramic pastes are dispensed through cylindrical fine nozzles (2– 250 μm) using CNC-controlled motion has enabled complex 3D geometries to be fabricated for high temperature electronic packaging applications
All of the sample sets exhibit an increase in die shear strength beyond 100°C, at 300°C, there is a compositional transition in the form of an increasing alloy presence as a product of the Cu layers becoming incorporated within the CuSn thin film
Summary
Across a myriad of industrial sectors, ranging from aviation, space, subsea, and energy, high value assets are deployed in harsh environments These environments are typically defined by challenging high values of temperature, pressure, radiation, vibration, and chemically corrosive conditions. Ceramics exhibit a range of desirable material characteristics including high hardness, excellent thermal, and electrical insulation, high resistance to wear, erosion, and corrosion [3]. These characteristics present a number of challenges during subsequent formative and manufacturing processes. Subsequent thermal processing decomposes the organic elements and induces sintering of the remaining inorganic elements
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