Abstract

Dielectric-silicon interfaces are becoming ever more important to device performance. Charge inside a surface dielectric layer is neutralized in Si leading to an accumulation or inversion layer of free carriers. Additionally, states at the interface are occupied by charges via Shockley-Read-Hall carrier statistics. It is accepted that the density of interface charge near midgap, which can only reach a concentration as high as the density of states, Dit, has a minor effect on band bending compared to the charges in the dielectric for a well passivated interface. Here, we show that it is the state density near the band edge what plays the major role. We conclude this by comparing our measurements with device modelling of a Si/SiO2 interface. We measure the wafer sheet resistance while applying various amounts of positive charge to the passivating dielectric on an n-type Si wafer, and then reproduce the measured resistance values using simulations. This modelling indicates that Dit at midgap has indeed a minor effect on sheet resistance change, while the total amount of tail states has a significant impact on the distribution of induced carriers. We test this model to detect the amount of acceptor-like states at the band-tails of oxide passivated silicon with different processing. We discuss and analyse the limitations of this technique. While we report on the Si/SiO2 interface due to its relevance in photovoltaics, our method can be used to study the properties of other semiconductor-dielectric interfaces. As such this work is of importance across various optoelectronic devices.

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