Extending WLCSP Packaging Technology Capabilities to Enable Miniaturized Sensor and MEMS Packaging Applications

Abstract

WLCSP has been widely deployed in portable computing and communication devices for efficient die level packaging of integrated semiconductor and integrated passive applications. More recently with the proliferation of smart phone capabilities and applications as well as the emergence of Internet of Things and Wearable Electronics, MEMS and sensor devices in minimized package formats have become increasingly pervasive. These include image sensors, light sensors, finger print sensors as well as accelerometer, gyroscope and other MEMS motion sensing devices. It is predicted that the widespread adoption of WLCSP packaging for sensing applications will accelerate the proliferation of the incorporation of multiple sensor technologies within future communication devices. A number of these MEMS/Sensor applications have been able to leverage the existing WLCSP technology infrastructure and has led to opportunities to packaging and cost-effective standardization and miniaturization. On the other hand, some significant new changes to WLCSP process flows have also emerged that have had to be addressed. This paper will provide an overview of MEMS and Sensor applications that are currently or will use 2D, 2.5D or 3D wafer level packaging formats. Process enhancements including the ability to process thinner substrates with the adoption of temporary carrier technologies will also be highlighted.