Exploring equivalence of information from dielectric and calorimetric measurements of thermoset cure—a model for the relationship between curing temperature, degree of cure and electrical impedance

Abstract

The paper presents a phenomenological model, which accounts for the observed similarity between change in the imaginary electrical impedance maximum (IIM) during the cure of a commercial epoxy system, RTM6, and the cure reaction rate data collected by differential scanning calorimetry (DSC) experiments on the same resin. The model is developed by analysing the information content of dielectric cure monitoring signals and calorimetric cure monitoring signals under both isothermal and non-isothermal cure conditions. The absolute values of the coefficients in the model equation are shown to be indicative of the relative effects of the polymerisation reaction and of the temperature on the dielectric signal. The information presented here strengthens the suggestion that on-line dielectric measurements may be used to quantify the degree of cure in thermosetting resins in real time.