Abstract
We report computational and experimental research results confirming that surfaces with porosity exceeding a certain threshold will fully suppress multipactor in parallel-plate microstripline structures, while negligibly perturbing the RF transmission properties. Our research also identified a practical arrangement of nonuniform pores that provided the required high-porosity for multipactor suppression, but with enhanced mechanical rigidity. This alternative layout facilitates the fabrication process using commercially-available manufacturing methods. Porous, multipactor-resistant surfaces can be used in a wide range of high-power components including high-power microwave sources, antennas, filters, and transmission lines (TLs).
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
