Abstract
Thermal gap pads are widely used for effective heat transfer from high-heat-dissipating components to a heat sink. The initial contact pressure of thermal pads is an important parameter for enhancing the heat transfer capability of thermal design during the assembly process of the heat sink. However, this causes stress on the solder joint of the component as a result of the pad’s inherent resistance to deformation. In this study, we investigated the effect of thermal pad on the fatigue life of the solder joint of CCGA 624 package for space usage. A random vibration fatigue test for several specimen assembly sets with various pressurization levels of thermal gap pads was performed, and their fatigue lives were compared with that of the package without the initial pressure of thermal gap pads.
Highlights
Integrated electronic packages such as a ball grid array (BGA), small outline package, and column grid array (CGA) offer several advantages for space applications owing to a drastic reduction in size and weight and efficient utilization of accommodation area of a printed circuit board (PCB) [1,2,3]
The time to reach the failure of the solder joint at the 50% ratio is 29.1 minutes, which is 8.49 times greater than that of the 0% ratio. These results indicate that the fatigue life on the solder joint under random vibration can be increased as the initial compressive static load of the thermal pad increases
This paper investigates the influence of initial compressive static load for a thermal gap pad, from the viewpoint of the solder joint fatigue life in a random vibration environment
Summary
Integrated electronic packages such as a ball grid array (BGA), small outline package, and column grid array (CGA) offer several advantages for space applications owing to a drastic reduction in size and weight and efficient utilization of accommodation area of a printed circuit board (PCB) [1,2,3]. The initial contact pressure of the pad might be advantageous in terms of securing the structural safety of the solder joint of the component in a vibration environment by restricting the displacement of the component This has not yet been investigated in the previous studies. In this study, we focus on the effect of the initial pressure level of the thermal gap pads from the viewpoint of fatigue life of the solder joint of the packages under a random vibration environment.
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